Arvind Pattamatta

This paper brings out the phenomenon of the influence of flow maldistribution on temperature distribution in parallel microchannel system that is supposed to have an adverse effect on hot spot formation in microelectronic devices. An extensive experimental study is carried out where in the parameters affecting the flow maldistribution such as channel hydraulic diameter, channel flow configurations (U, Z, I type) and chip power are varied to study their effect on the pressure drop and temperature distribution across the parallel channels designed for liquid cooling of a CPU using distilled water. It is observed that the flow distribution among the channels improves significantly with a decrease in the channel hydraulic diameter due to higher pressure drop offered by each individual channels simultaneously. This results in a considerable reduction in both the peak temperature and the average temperature of the device with decrease in channel diameter and better temperature distribution. It is observed that a higher pressure drop in d = 88 μm induces more uniform distribution compared to d = 176 μm resulting in a 3 C improvement in the standard deviation of temperature on the chip surface and a reduction in maximum surface temperature. Higher heat fluxes induce a reduction in viscosity of the fluid resulting in higher flow maldistribution. © 2014 Elsevier Ltd. All rights reserved.

A common assumption in basic heat exchanger design theory is that fluid is distributed uniformly at the inlet of the exchanger on each fluid side and throughout the core. However, in reality, uniform flow distribution is never achieved in a heat exchanger and is referred to as flow maldistribution. Flow maldistribution is generally well understood for the macrochannel system. But it is still unclear whether the assumptions underlying the flow distribution in conventional macrochannel heat exchangers hold good for microchannel system. In this regard, extensive numerical simulations are carried out in a "U" type parallel microchannel system in order to study flow and heat transfer maldistribution and validated with in-house experimental data. A detailed parametric analysis is carried out to characterize flow maldistribution in a microchannel system and to study the effect of geometrical factors such as number of channels, n, Area of cross section of the channel Ac, manifold cross section area Ap, and flow parameter such as Reynolds number, Re, on the pressure and temperature distribution. In order to minimize the variation in pressure and to reduce temperature hot spots in the microchannel, a response surface based surrogate approximation and a gradient based search algorithm are used to arrive at the best configuration of microchannel cooling system. A three level factorial design involving three parameters namely Ac/Ap, Re, n are considered. The results from the optimization indicate that the case of n=7, Ac/Ap=0.69, and Re=100 is the best possible configuration to alleviate flow maldistribution and hotspot formation in microchannel cooling system. © 2013 by ASME.

This paper brings out the phenomenon of flow maldistribution in parallel microchannel systems, which is supposed to have an adverse effect on hot spot formation and temperature distribution in microelectronic devices. An extensive experimental study is carried out where in the parameters affecting the flow maldistribution such as number of channel, area of cross section of the manifold, channel hydraulic diameter, and Reynolds number are varied to study their effect on the pressure drop across the parallel channels designed for liquid cooling of a CPU. It is observed that the flow distribution among the channels improves significantly with a decrease in the channel hydraulic diameter due to higher pressure drop offered by each individual channels simultaneously. This results in a considerable reduction in both the peak temperature and the average temperature of the device with decreasing channel diameters. It is also inferred that the flow maldistribution is relatively invariant with Reynolds number for the microchannel system, which is not the case for the macrochannels. Flow maldistribution is found to increase with increase in number of channels and with a decrease in the manifold area relative to the channel area. The 'I' type flow configuration is found to have the least maldistribution while the 'U' type shows the maximum and Z type falls in between. A simple force analysis of the governing equation in the manifold of the parallel microchannel system reveals a strong dominance of the frictional force over the inertial force and both the forces contribute to the uniform flow distribution at smaller hydraulic diameters, where the 1-D theoretical models failed to achieve a concurrence with the present experimental results. Also the present 3-D numerical simulations give a satisfactory agreement with the experimental results projecting it as an effective tool in the design and analysis of microchannel cooling system. The potential zones of hot spots are identified as low fluid velocity zones or low pressure drop zones among the channels resulting from flow maldistribution. © 2011-2012 IEEE.