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Digital photothermoelastic and numerical analysis of transient thermal stresses in cracked bimaterial interfaces
Date Issued
01-12-2009
Author(s)
Neethi Simon, B.
Ramesh, K.
Abstract
Transient thermal stresses of a bimaterial specimen with interface cracks, under uniform cooling by convection, are analyzed by photothermoelasticity and a coupled temperature-displacement, finite element scheme. The stress intensity factors of the interface crack are determined by a multiparameter overdeterministic system of equations in a least-squares sense using the experimental data and by J-integral, numerically. The study showed that a normal temperature variation can lead to significant stresses due to the mismatch of thermal expansion coefficients. © 2009 by ASME.
Volume
76