Publication:
Micromachining for silicon microaccelerometer

Simple item page
cris.author.scopus-author-id35600309300
dc.contributor.authorBhat, K. N.
dc.date.accessioned2023-09-20T05:54:54Z
dc.date.available2023-09-20T05:54:54Z
dc.date.issued01-12-1996
dc.description.abstractIn this paper, the concepts of "bulk" and "surface" micromachining are first presented. The fabrication techniques for realising silicon microaccelerometer using these two approaches are next presented. In both the cases, the acceleration is measured by detecting the change in the capacitance due to the deflection of an inertial mass called seismic mass or proof mass with respect to fixed plates. The relative merits of the two approaches are presented to show that inspite of the simplicity and low cost nature of bulk micromachining, the surface micromachining has gained popularity because of its versatility and suitability for integrating the surface micromachined sensors with the integrated circuits.
dc.identifier.doi10.1117/12.305558
dc.identifier.issn0277786X
dc.identifier.scopus2-s2.0-0030316623
dc.identifier.urihttps://apicris.irins.org/handle/IITM2023/57943
dc.relation.ispartofseriesProceedings of SPIE - The International Society for Optical Engineering
dc.sourceProceedings of SPIE - The International Society for Optical Engineering
dc.subjectAnisotropic etching
dc.subjectBulk micromachining
dc.subjectEtch stop
dc.subjectFusion bonding
dc.subjectMicroaccelerometer
dc.subjectPolysilicon
dc.subjectProof mass
dc.subjectSeismic mass
dc.subjectSurface micromachining
dc.titleMicromachining for silicon microaccelerometer
dc.typeConference Proceeding
dspace.entity.typePublication
oaire.citation.endPage273
oaire.citation.startPage262
oaire.citation.volume3321
person.affiliation.cityChennai
person.affiliation.id60025757
person.affiliation.nameIndian Institute of Technology Madras
Files
Collections
Publication11