Recovery of Metals from Discarded Integrated Circuits

The present study reports a processing route to recover metals from integrated circuits of discarded random access memory (RAM) units containing similar to 66% printed circuit boards and similar to 33% integrated circuits. The integrated circuits are manually separated, grounded, classified, and subjected to water fluidization for the effective separation of metals. The significant separation was achieved via water fluidization, and the underflow fraction was magnetically separated. The magnetic fraction was thermally exposed in a muffle furnace, and the process optimization was carried out using a Box-Behnken statistical design. The detailed characterization at subsequent steps significantly aids the understanding of metal-plastic separation and enrichment. A concentrate containing 97% metals (Fe-59%, Ni-9.5%, Cu-7.7%, Sn-13.4%, Pb-5.6%, Ag-1.6%) with 96 wt% recovery can be recovered from discarded IC units. The process pursued is simple, adaptable, and environment-friendly, and the product can be used in conventional smelters.