Tapering and size reduction of single-mode silicon waveguides by maskless RIE

Date Issued
23-10-2012
Author(s)
Chandran, S.
Indian Institute of Technology, Madras
DOI
Abstract
Two-step reactive ion etching process has been optimized to demonstrate small cross-section single-mode silicon waveguides. This technique has helped to reduce the insertion loss of compact integrated photonic devices in SOI platform up to 3 dB. © 2012 IEEE.
Subjects