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Effect of RF sputtering parameters on the nanoscratch properties of quinary Ti-Zr-Cu-Ni-Al thin film metallic glass
Date Issued
05-07-2022
Author(s)
Paremmal, Priyesh
Karati, Anirudha
Das, Ritu
Seshadri, R.
Raghothaman, H.
Loganathan, S.
Ramachandra Rao, M. S.
Murty, B. S.
Abstract
Recently, thin film metallic glasses (TFMGs) gained renewed attention as they can circumvent the brittleness problem of bulk metallic glasses. When sputtered from a multicomponent cast target, the composition control of TFMG is always challenging. Here, we demonstrate the tight composition control of sputtered Ti-Zr-Cu-Ni-Al TFMG by a spark plasma sintered multicomponent target and investigate their structural and nanoscratch properties. The radio frequency (RF) power and Ar pressure were tuned to optimize nanoscratch properties. The highest hardness (~16.2 GPa) and thus best nanoscratch resistance was obtained at an RF power of 160 W and Ar pressure of 7 Pa. The best nanoscratch properties originated from the dense, fine column morphology of the TFMG. Moreover, it was found that the scratch mechanism changed from plowing to a combination of plowing and stick-slip under a ramping scratching load of 10 mN. The transition happened progressively at lower loads when the hardness of the TFMG decreased. This study provides a useful guideline for developing TFMG as a scratch-resistant protective coating.
Volume
908