Micromachining for microelectromechanical systems

The various micromachining processes required for microengineering and for the successful realisation of microeletromechanical systems on Si are presented. The techniques presented include bulk and surface micromachining, Si fusion bonding, and the lithography, electroforming and micromoulding (LIGA) process. The paper also includes discussion on the markets, applications and future trends for microenginerated products.