Characterization of Single-grit Grooving Process of Silicon Carbide Ceramic Using Multisensory Approach

For ductile regime machining of ceramic materials, it is necessary to analyse the material removal mechanism through single grit scratch test, since it aids to identify the microscopic interaction between the tool and the workpiece. Micro grooving process has been performed on Silicon Carbide ceramics using a hinged scratch setup with diamond indenter as the tool. During the grooving process, Horizontal Cutting Force (HCF) and several Acoustic Emission (AE) parameters has been monitored for identifying the modes of material removal. The factors considered for the characterization of the grooving process are normal load, approach angle of the indenter, grooving speed and indenter radius. The study revealed that most of factors had significant effect on the responses of force and multiple responses of AE signal. Material removal mechanism such as plowing, ductile mode of material removal, Ductile to Brittle Transition (DBT) and microcracking or brittle mode of material removal were characterised using multisensory approach.