Evaluation of Process Parameters of ECDM using Grey Relational Analysis

Semi conducting materials like silicon, germanium, tellurium are in high demand in Micro Electro Mechanical Systems (MEMS) applications like lab-on-chip devices, micro sensors, micro pumps..etc. Micro machining of the silicon for various applications in MEMS is tedious and time consuming. Electro Chemical Discharge Machining (ECDM) process is an advanced hybrid process used to machine electrically conducting as well as non-conducting materials. In the present paper, an attempt has been made to machine silicon wafer of 500 micrometer thickness using stainless steel wire. Characterization of micro holes has been reported mainly in terms of material removal rate, radius of overcut and heat affected zone. The machining parameters are optimized using multi response analysis - Grey Relation Method. The detailed results are presented in the paper. (C) 2014 Elsevier Ltd.