A study on the thermal aspects of chips in grinding

Heat transfer theory is applied to the grinding process to obtain a model for the chip temperature in dry surface grinding. This model predicts the temperature of the chips with respect to time as they leave the grinding zone. Chips produced in grinding are small and their sizes vary considerably. Their temperatures vary with respect to time or the distance from the wheel-work interface. This model is of use in understanding the spark intensities produced in grinding. © 1992.