Elastic moduli of coppered and tinned binary alloys

Using the ultrasonic wedge method, the effect of addition of up to 5% of a third metal (Cu or Sn) on the elastic moduli in Ag-Au+Cu, Ag-Pb+Cu, Pb-Sn+Cu, Cu-Sn, Cu-Ag+Sn and Cu-Pb+Sn systems has been investigated. It is found that the elastic moduli in general increase up to about 2% of the added third metal beyond which a deleterious effect sets in. The results suggest possible changes in structure or eutectic formation to occur at around 2% concentration of Cu or Sn in the above ternary systems. © 1973.