Repository logo
  • English
  • Català
  • Čeština
  • Deutsch
  • Español
  • Français
  • Gàidhlig
  • Italiano
  • Latviešu
  • Magyar
  • Nederlands
  • Polski
  • Português
  • Português do Brasil
  • Suomi
  • Svenska
  • Türkçe
  • Қазақ
  • বাংলা
  • हिंदी
  • Ελληνικά
  • Yкраї́нська
  • Log In
    or
    New user? Click here to register.Have you forgotten your password?
Repository logo
  • Communities & Collections
  • Research Outputs
  • Fundings & Projects
  • People
  • Statistics
  • English
  • Català
  • Čeština
  • Deutsch
  • Español
  • Français
  • Gàidhlig
  • Italiano
  • Latviešu
  • Magyar
  • Nederlands
  • Polski
  • Português
  • Português do Brasil
  • Suomi
  • Svenska
  • Türkçe
  • Қазақ
  • বাংলা
  • हिंदी
  • Ελληνικά
  • Yкраї́нська
  • Log In
    or
    New user? Click here to register.Have you forgotten your password?
  1. Home
  2. Indian Institute of Technology Madras
  3. Publication13
  4. Influence of crack closure on the stress intensity factor for plates subjected to bending-A 3-D finite element analysis
 
  • Details
Options

Influence of crack closure on the stress intensity factor for plates subjected to bending-A 3-D finite element analysis

Date Issued
01-01-1983
Author(s)
Alwar, R. S.
Nambissan, K. N.Ramachandran
DOI
10.1016/0013-7944(83)90083-8
Abstract
Plates with central through cracks subjected to bending is analysed taking into account the closure of the crack faces on the compression side. A three-dimensional finite element method employing three-dimensional degenerate solid element is used for the analysis. The crack faces have been modelled such that they come in contact over an area on the compression side and interfere with each other. The influence of the crack closure on the variation of the stress intensity factor across the plate thickness is obtained for finite and infinite plate geometries. © 1983.
Volume
17
Indian Institute of Technology Madras Knowledge Repository developed and maintained by the Library

Built with DSpace-CRIS software - Extension maintained and optimized by 4Science

  • Cookie settings
  • Privacy policy
  • End User Agreement
  • Send Feedback